Application
| System | |
|---|---|
| Processor |
Intel® 12th generation Core I Processor |
| System Memory |
Support DDR4 3200 SO-DIMM x 2 up to 64GB |
| Storage Disk Drive |
2.5" SATA SSD x 1 M.2 M Key 2280//2260/2242 NVMe x 1 |
| OS Support |
Microsoft® Windows 10 Microsoft® Windows® 11 Linux with Jetpack OS |
| Security |
Trusted Platform Module 2.0(TPM 2.0) |
| Wireless Communication |
N/A |
| Expansion |
M.2 E Key 2230 x 1 for Wireless module PCIe 4.0[x16] x1 PCIe 4.0[x4] x1 (Optional) |
| Chipset |
Intel® Q670 |
| Graphics |
N/A |
| Function Key |
N/A |
| Camera |
N/A |
| Power |
AC input / 100V to 240V AC Input |
| Display | |
|---|---|
| Size |
N/A |
| Resolution |
N/A |
| Luminance |
N/A |
| Touch Screen |
N/A |
| Contrast Ratio |
N/A |
| View Angle |
N/A |
| Max. Colors |
N/A |
| Back Light Life Time |
N/A |
| I/O | |
|---|---|
| USB |
USB 2.0 x2 USB 3.2 Gen 2 x 4 |
| Ethernet |
2.5 GigaLAN x 2 |
| Audio |
Line-out x 1 Mic-in x 1 |
| Serial Port |
RS-232 x 2 |
| COM |
N/A |
| Video Out |
DP x 2 HDMI x 1 VGA x 1 |
| Video In |
N/A |
| Mechanical and Environmental | |
|---|---|
| Operating Temperature |
0°C ~ 35°C(32°F ~ 95°F) |
| Storage Temperature |
-20°C ~ 60°C(-4°F ~ 140°F) |
| Dimension |
419mm x 355mm x 90 mm |
| Package Size |
TBD |
| Gross Weight |
TBD |
| Mounting VESA |
N/A |
| Degree of Protection |
N/A |
| Certifications |
CE: EN 60601-1-2:2015(V4.0) CE:EN 60601-1:2006/A1:2013(V3.1) cUL: CAN/CSA-C22.2 No. 60601-1:2014 (V3.1) FCC: Part 18 Class B UL: ANSI/AAMI ES60601-1:2012 (V3.1) |